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Panel Level Packaging Panel Level SiP Used In Various Industries
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fanout Process and Product |
| Model Number: | SiP |
Payment & Shipping Terms:
| Delivery Time: | 1 month |
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| Payment Terms: | T/T |
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Detail Information |
Product Description
Description:
310*320mm panel size;
Advantage:Small SiP package size,such as 6*6mm/7.5*7.5mm;low power consumption;multi-chip packages, high assembly efficiency.
Technical capability: different functional dies are assembled in one system,for example, MCU, Bluetooth and some passive chips are assembled in terms of SMT process(e.g., solder printing, die /passive components placement and reflow soldering). After above assembly, the individual SiP is tested or customer confirmation. In addition to above SiP assembly, there are so many chances to implant chips to the panel substrate which can be connected with other die assemblies in terms of flip chip assembly and SMT process.
Applications:
The technology has been widely used in various industries, including consumer electronics, automotive, aerospace and medical devices.
Competitive Advantage:
1,Small size
2,low power consumption
3,multi-chip package,high assembly efficiency
4,flexible for die implanted to the panel substrate before SMT assembly