Send Message

Leave a Message

We will call you back soon!

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Your message must be between 20-3,000 characters!

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Please check your E-mail!

SUBMIT

More information facilitates better communication.

Mr.
  • Mr.
  • Mrs.
OK

Submitted successfully!

We will call you back soon!

OK

Leave a Message

We will call you back soon!

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Your message must be between 20-3,000 characters!

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Please check your E-mail!

SUBMIT
Please leave your correct email and detailed requirements.
OK
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
  • Home
  • Products
    Panel Level Packaging Form
    Panel Level Packaging Chip
    Panel Level Packaging Product Structure
    Fan Out Panel Level Packaging
    TGV Through Glass Via
    Packaging Simulation Experiments
  • Videos
  • About Us
    About Us
    Factory Tour
    Quality Control
  • Contact Us
English
  • English
  • French
  • German
  • Italian
  • Russian
  • Spanish
  • Portuguese
  • Dutch
  • Greek
  • Japanese
  • Korean
Request A Quote
Home

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. products online

Catagories

  • Panel Level Packaging Form(3)

  • Panel Level Packaging Chip(4)

  • Panel Level Packaging Product Structure(4)

  • Fan Out Panel Level Packaging(5)

  • TGV Through Glass Via(7)

  • Packaging Simulation Experiments(1)

Contacts
Contacts: Mr. LIN TINGYU
Tel: +8615358053318
Contact Now
  • Good price Package Suitable For Various Packaging Simulation Experiments online

    Package Suitable For Various Packaging Simulation Experiments

    Get Best Price
  • Good price Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen online

    Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen

    Get Best Price
  • Good price Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test online

    Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test

    Get Best Price
  • Good price High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips online

    High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips

    Get Best Price
  • Good price high aspect ratio TGV Foundary Capabilities for semiconductor packaging online

    high aspect ratio TGV Foundary Capabilities for semiconductor packaging

    Get Best Price
  • Good price High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm online

    High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm

    Get Best Price
  • Good price Glass Substrate Technology-Plating Double Side Stable And Easily Maintain online

    Glass Substrate Technology-Plating Double Side Stable And Easily Maintain

    Get Best Price
  • Good price 12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness online

    12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness

    Get Best Price
  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product online

    310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product

    Get Best Price
  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package online

    310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package

    Get Best Price
  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package online

    310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package

    Get Best Price
  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF) online

    310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)

    Get Best Price
  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED online

    310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED

    Get Best Price
  • Good price Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package online

    Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package

    Get Best Price
  • Good price Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability online

    Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability

    Get Best Price
  • 1
  • 2
  • >
  • >>
About
Home Products About Us Sitemap Mobile Site Privacy Policy
Panel Level Packaging Form

  • Panel Level Packaging Panel Level SiP Used In Various Industries

  • 0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter

  • 310*320mm Panel Size Panel Level QFN Low Electrical Resistance

Panel Level Packaging Chip

  • 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）

  • LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm

  • 310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

Follow Us
Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
+8615358053318
tingyulin@fzxsmc.com
Mail Us
China Good Quality Panel Level Packaging Form Supplier. © 2024 fozhixinsmc.com. All Rights Reserved.