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310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fanout Process and Product |
| Model Number: | Resistance chip |
Payment & Shipping Terms:
| Minimum Order Quantity: | 3000pcs |
|---|---|
| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
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Detail Information |
Product Description
Description:
Chip size: 0.76*0.61; 1.43 * 1.06；
Package size: 2.76*1.97; 2.58 * 2.92；
Package thickness: 360um；
Process introduction:
After the chip is reconstructed to the temporary carrier board, the pick and placement is performed and later plastic compressive molding, followed by grinding, laser opening, and then laser + electroplating.
Applications:
Power management；
Specifications:
Chip size: 0.76*0.61; 1.43 * 1.06；
Package size: 2.76*1.97; 2.58 * 2.92；
Package thickness: 360um；
Competitive Advantage:
High precision, fast response,low power consumption and stability.
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