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310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fanout Process and Product |
| Model Number: | Multi-chip MOSFET |
Payment & Shipping Terms:
| Minimum Order Quantity: | 3000pcs |
|---|---|
| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
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Detail Information |
Product Description
Description:
Multi-chip MOSFET
310*320mm panel size;
Package size: 2.0*2.0mm;
Package thickness: 0.5mm;
Chip size: 1.0*1.6mm;
Process type: FOPLP (Face Up);
Applications:
Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc.
Competitive Advantage:
1,Low electrical resistance , such as 0.1,0.2
2,Low power consumption
3,High efficient heat dissipation
4,Thin package
5,Low price
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