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China Panel Level Packaging Form & Panel Level Packaging Chip Manufacturer

Package Suitable For Various Packaging Simulation Experiments
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Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen
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Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test
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High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips
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high aspect ratio TGV Foundary Capabilities for semiconductor packaging
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High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm
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Glass Substrate Technology-Plating Double Side Stable And Easily Maintain
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12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness
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310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package
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310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin (FZX）microelectronic technology research Pte Ltd was registered in Foshan city, Guangdong province of PRC, 2018. FZX was focus on panel level packaging technology development and mass production. At present, FZX has a factory which was about more than 2000 meter square. In addition, there is another mass production site being built up with more than 5000 meter square in Foshan ...

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China Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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China leading provider of Panel Level Packaging Form & Panel Level Packaging Chip

quality Package Suitable For Various Packaging Simulation Experiments factory

Package Suitable For Various Packaging Simulation Experiments

— Products —

quality Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen factory

Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen

— Products —

quality Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test factory

Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test

— Products —

quality High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips factory

High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips

— Products —

quality high aspect ratio TGV Foundary Capabilities for semiconductor packaging factory

high aspect ratio TGV Foundary Capabilities for semiconductor packaging

— Products —

quality High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm factory

High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm

— Products —

quality Glass Substrate Technology-Plating Double Side Stable And Easily Maintain factory

Glass Substrate Technology-Plating Double Side Stable And Easily Maintain

— Products —

quality 12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness factory

12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness

— Products —

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