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Panel Level Packaging Form

Panel Level Packaging Panel Level SiP Used In Various Industries
0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter
310*320mm Panel Size Panel Level QFN Low Electrical Resistance

Panel Level Packaging Chip

310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm
310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

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