 |
310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fanout Process and Product |
| Model Number: | FZX-IC Chip |
Payment & Shipping Terms:
| Minimum Order Quantity: | 3000pcs |
|---|---|
| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
|
Detail Information |
Product Description
Description:
Panel size:310*320mm;
Package size: 12*18*0.9mm;
Package thickness: 0.9mm;
Brief introduction to the process: After the temporary carrier board is attached, plastic sealing and chip reconstruction are done, the first layer of RDL is made, followed by etching +ABF pressing + laser drilling + second layer of RDL, and finally green oil solder mask + nickel-palladium metal is the final protective layer attached.
Applications:
computer
Specifications:
Panel size:310*320mm;
Package size: 12*18*0.9mm;
Package thickness: 0.9mm;
Competitive Advantage:
1,Improve function density
2,shorten interconnection length
3,system reconfiguration
Want to Know more details about this product