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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fan-Out Panel Level Packaging |
| Model Number: | Face up-wafer bump |
Payment & Shipping Terms:
| Minimum Order Quantity: | 3000pcs |
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| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
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Detail Information |
Product Description
Description:
Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surface treanment and laser cutting will be performed. The process is simple and has the advantage of low cost.
Competitive Advantage:
- Using the bump of chip can be grinded after C mold, RDL can be made along the surface of molding
- Thick copper (20-50um)can be made to increase the heat dissipation.
- Double side plating can be performed simultaneously
- Low cost
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