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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fanout Process and Product |
| Model Number: | Face up-wire bond ball |
Payment & Shipping Terms:
| Minimum Order Quantity: | 3000pcs |
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| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
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Detail Information |
Product Description
Description:
As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond process, it is similar to bump of chip, therefore, it has higher integration, high reliability, and low cost; through the FOPLP process , multiple MCU and MOS chips can be integrated and packaged; It can be used in various application scenarios such as power management, new electric vehicles (EV) and robot arms, and has broad market prospects.
Applications:
It can be used in various application scenarios such as power management, new electric vehicles (EV) and robot arms, and has broad market prospects.
Competitive Advantage:
- Low cost
- Flexibility for manufacturing
- Double side plating
- Thick Cu for heat dissipation
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