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China Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Sitemap
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Fan Out Panel Level Packaging
310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
TGV Through Glass Via
High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm
Glass Substrate Technology-Plating Double Side Stable And Easily Maintain
12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness
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