• 310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED

310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED

Product Details:

Place of Origin: PR China
Brand Name: FZX Fanout Process and Product
Model Number: FZX-CPO/mini/micro LED

Payment & Shipping Terms:

Minimum Order Quantity: 3000pcs
Delivery Time: 1 month
Payment Terms: T/T
Supply Ability: stable
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Detail Information

Product Description

310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED 0

 

Description:

LED constant current driver chip;

Chip size 0.4mm*0.555mm*0.20mm;

Panel size 310*320mm;

Package size 122mm*50mm;

Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating.

 

310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED 1

 

 

Applications:

Mini-LED, lamps

 

 

Specifications:

Chip size 0.4mm*0.555mm*0.20mm;

Panel size 310*320mm;

Package size 122mm*50mm;

 

 

Competitive Advantage:

1. high assembly efficiency

2. Simple process and low cost

 

 

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