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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. products online

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  • Panel Level Packaging Form(3)

  • Panel Level Packaging Chip(4)

  • Panel Level Packaging Product Structure(4)

  • Fan Out Panel Level Packaging(5)

  • TGV Through Glass Via(7)

  • Packaging Simulation Experiments(1)

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Contacts: Mr. LIN TINGYU
Tel: +8615358053318
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  • Good price Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball online

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  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon） online

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  • Good price LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm online

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  • Good price 310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption online

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  • Good price Panel Level Packaging Panel Level SiP Used In Various Industries online

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  • Good price 0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter online

    0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter

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  • Good price 310*320mm Panel Size Panel Level QFN Low Electrical Resistance online

    310*320mm Panel Size Panel Level QFN Low Electrical Resistance

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  • Good price 310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon） online

    310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）

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Panel Level Packaging Form

  • Panel Level Packaging Panel Level SiP Used In Various Industries

  • 0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter

  • 310*320mm Panel Size Panel Level QFN Low Electrical Resistance

Panel Level Packaging Chip

  • 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）

  • LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm

  • 310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

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