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high aspect ratio TGV Foundary Capabilities for semiconductor packaging
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX -TGV |
| Model Number: | TGV Foundary |
Payment & Shipping Terms:
| Minimum Order Quantity: | 10 panel |
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| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
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Detail Information |
Product Description
Description:
As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:10 to 1:160. The line width/space can be varied from 10um to 15um. The most important factor here is the adhesion between glass and copper is controlled from 10N/cm to 15N/cm. The roughness of glass can be controlled well in order to keep high adhesion.
Applications:
1,In the field of semiconductor packaging, glass substrate can meet the needs of larger size packaging due to its significant electrical and mechanical performance advantages, and become an important direction for the development of advanced packaging in the future.
2,In the field of display technology, glass substrates are widely used in the manufacture of liquid crystal displays and other flat panel display devices, such as tablet PCs, cell phones, and TVs.
Competitive Advantage:
- Very high aspect ratio (diameter/thickness of the glass): 1:10-1:160
- Very high adhesion strength between copper and glass
- Several glass types can be used in the production line, process window is wider.
- Shape of glass, uniformity and angle can be steadily controlled.