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High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fanout Process and Product |
| Certification: | CE, Rohs, FCC |
| Model Number: | FZX-TH2 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 10 panel |
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| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
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Detail Information |
Product Description
Description:
As shown below photo, the blind or through holes can be made with angle controlling, the laser and acid methodology can be combined together to make customer specific holes. The glass can be coming from different suppliers, e.g., AF32/BF33 (Schott), EAGLE XG or AGC, etc. The shape of hole, uniformity of hole, can be controlled as well.
Panel size: 510mmX515mm or below (can combined different size for fitting the size of 510mmX515mm)
Panel thickness: 0.2mm-5mm
Accuracy of position:1mu
Efficiency of hole manufacturing: 2000-5000 holes/second
Aperture: 35/30(top/middle)
Density of hole: 3um-200um (diameter)
Applications:
Used for GPU/CPU/AI chips on super computing, sever, cloud application.
Competitive Advantage:
- “X”shape hole and vertical hole can be controlled and made and meet the customer requirement.
- Aspect ratio hole can be steadily controlled within 1:10-1:20
- Different density of TGV holes can be manufactured within one panel.
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