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310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fanout Process and Product |
| Model Number: | FZX-GaN |
Payment & Shipping Terms:
| Minimum Order Quantity: | 3000pcs |
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| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
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Detail Information |
Product Description
310*320mm Panel size;
DIE1 size:1.89*1.64mm;
DIE2 size:0.926*0.626mm;
Package size:6*7mm;
Package thickness: 0.42mm;
Process flow:
The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the back of the plastic sealing material, the second layer of process is adding the green oil solder mask and nickel gold protection.
Applications:
Used in gallium nit-ride power devices, chargers, power equipment and other fields,Gallium nitride power devices, chargers, power supply equipment, etc
Competitive Advantage:
1. Thick Cu for high heat dissipation of the package
2. Simple process and low cost
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