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310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fanout Process and Product |
| Model Number: | Radio Frequency (RF) |
Payment & Shipping Terms:
| Minimum Order Quantity: | 3000pcs |
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| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
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Detail Information |
Product Description
Description:
Panel size:310*320mm
Package size: 7*6mm
Package thickness: 0.75mm
Process flow:
The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the back of the plastic sealing material, the second layer of process is adding the green oil solder mask and nickel gold protection. Dk and Df are required to maintain the low value for RF products.
Specifications:
Panel size:310*320mm
Package size: 7*6mm
Package thickness: 0.75mm
Competitive Advantage:
1. Maintaining low lose for RF products.
2. Low cost and high integration for multi-RF module
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