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310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fanout Process and Product |
| Model Number: | MEMS |
Payment & Shipping Terms:
| Minimum Order Quantity: | 3000pcs |
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| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
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Detail Information |
Product Description
Description:
Plating uniformity: ≤10%;
Package size: 3*2mm;
Package thickness: 0.26mm;
Chip size: 0.96*0.78mm;
Process type: FOPLP (310X320mm);
Applications:
Mobile phone, Bluetooth headset,MEMS, wearable electronics.
Specifications:
Package size: 3*2mm;
Package thickness: 0.26mm;
Chip size: 0.96*0.78mm;
Competitive Advantage:
Low cost, simple structure,high yield
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