 |
310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package
Product Details:
| Place of Origin: | PR China |
| Brand Name: | FZX Fanout Process and Product |
| Model Number: | FZX- power package |
Payment & Shipping Terms:
| Minimum Order Quantity: | 3000pcs |
|---|---|
| Delivery Time: | 1 month |
| Payment Terms: | T/T |
| Supply Ability: | stable |
|
Detail Information |
Product Description
Description:
310*320mm panel size;
Package size: 2.0*2.0mm;
Package thickness: 0.5mm;
Chip size: 1.0*1.6mm;
Process type: FOPLP (Face Up);
Process flow: face up encapsulation method is adopted. After a single patch, bump, plastic sealing and grinding (exposing the ball), then punch holes and electroplating to guide the upper and lower lines, and finally make a protective layer.
Applications:
New energy vehicles, power management, etc
Specifications:
310*320mm panel size;
Package size: 2.0*2.0mm;
Package thickness: 0.5mm;
Chip size: 1.0*1.6mm;
Competitive Advantage:
1,High efficient heat dissipation
2,Thin package
3,Low price
Want to Know more details about this product